Zuhause / Produkte / Widerstände / Widerstände zur Gehäusemontage / BDS2A100330RK
Herstellerteilenummer | BDS2A100330RK |
---|---|
Zukünftige Teilenummer | FT-BDS2A100330RK |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | BDS, CGS |
BDS2A100330RK Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 330 Ohms |
Toleranz | ±10% |
Leistung (Watt) | 100W |
Zusammensetzung | Thick Film |
Temperaturkoeffizient | ±150ppm/°C |
Betriebstemperatur | -55°C ~ 125°C |
Eigenschaften | RF, High Frequency |
Beschichtung, Gehäusetyp | Epoxy Coated |
Montagefunktion | Flanges |
Größe / Abmessung | 1.488" L x 1.000" W (37.80mm x 25.40mm) |
Höhe - sitzend (max.) | 0.827" (21.00mm) |
Führungsstil | M4 Threaded |
Paket / fall | SOT-227-2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
BDS2A100330RK Gewicht | kontaktiere uns |
Ersatzteilnummer | BDS2A100330RK-FT |
THS75220RJ
TE Connectivity Passive Product
THS75680RJ
TE Connectivity Passive Product
THS756R8J
TE Connectivity Passive Product
THS75470RJ
TE Connectivity Passive Product
THS75510RJ
TE Connectivity Passive Product
THS75100RJ
TE Connectivity Passive Product
THS1010KJ
TE Connectivity Passive Product
THS7547RJ
TE Connectivity Passive Product
THS7533RJ
TE Connectivity Passive Product
THS7522RJ
TE Connectivity Passive Product
LCMXO2280C-3TN144I
Lattice Semiconductor Corporation
A3P060-2VQ100I
Microsemi Corporation
AGL125V2-VQG100I
Microsemi Corporation
EP2AGZ225HF40C4N
Intel
5AGXMA5D4F27C4N
Intel
5SGXEA5K2F35I3L
Intel
XC5VLX50T-1FF665C
Xilinx Inc.
LFE2M50SE-5FN672C
Lattice Semiconductor Corporation
EP1AGX50DF780C6
Intel
EP1C12F324I7N
Intel