Zuhause / Produkte / Widerstände / Widerstände zur Gehäusemontage / BDS2A10047RK
Herstellerteilenummer | BDS2A10047RK |
---|---|
Zukünftige Teilenummer | FT-BDS2A10047RK |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | BDS, CGS |
BDS2A10047RK Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 47 Ohms |
Toleranz | ±10% |
Leistung (Watt) | 100W |
Zusammensetzung | Thick Film |
Temperaturkoeffizient | ±150ppm/°C |
Betriebstemperatur | -55°C ~ 125°C |
Eigenschaften | RF, High Frequency |
Beschichtung, Gehäusetyp | Epoxy Coated |
Montagefunktion | Flanges |
Größe / Abmessung | 1.488" L x 1.000" W (37.80mm x 25.40mm) |
Höhe - sitzend (max.) | 0.827" (21.00mm) |
Führungsstil | M4 Threaded |
Paket / fall | SOT-227-2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
BDS2A10047RK Gewicht | kontaktiere uns |
Ersatzteilnummer | BDS2A10047RK-FT |
THS255R0J
TE Connectivity Passive Product
THS2512RJ
TE Connectivity Passive Product
THS50R02J
TE Connectivity Passive Product
THS25R47J
TE Connectivity Passive Product
THS75150RJ
TE Connectivity Passive Product
THS75220RJ
TE Connectivity Passive Product
THS75680RJ
TE Connectivity Passive Product
THS756R8J
TE Connectivity Passive Product
THS75470RJ
TE Connectivity Passive Product
THS75510RJ
TE Connectivity Passive Product
XC3S400-4FG320C
Xilinx Inc.
XC3S250E-4VQG100I
Xilinx Inc.
A42MX36-CQ256M
Microsemi Corporation
AGLN060V5-ZVQG100
Microsemi Corporation
10M16DCF256C8G
Intel
EP1K10FC256-2
Intel
5SGXMA4K3F35C2LN
Intel
LFEC10E-4FN484I
Lattice Semiconductor Corporation
EP2AGX65DF29C4N
Intel
EP2SGX30CF780C3N
Intel