Herstellerteilenummer | EPC8009 |
---|---|
Zukünftige Teilenummer | FT-EPC8009 |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | eGaN® |
EPC8009 Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
FET-Typ | N-Channel |
Technologie | GaNFET (Gallium Nitride) |
Drain-Source-Spannung (Vdss) | 65V |
Strom - kontinuierliche Entleerung (Id) bei 25 ° C | 2.7A (Ta) |
Antriebsspannung (Max Rds On, Min Rds On) | 5V |
Rds On (Max) @ Id, Vgs | 130 mOhm @ 500mA, 5V |
Vgs (th) (Max) @ Id | 2.5V @ 250µA |
Gateladung (Qg) (Max) @ Vgs | 0.45nC @ 5V |
Vgs (Max) | +6V, -4V |
Eingangskapazität (Ciss) (Max) @ Vds | 52pF @ 32.5V |
FET-Funktion | - |
Verlustleistung (max.) | - |
Betriebstemperatur | -40°C ~ 150°C (TJ) |
Befestigungsart | Surface Mount |
Supplier Device Package | Die |
Paket / fall | Die |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
EPC8009 Gewicht | kontaktiere uns |
Ersatzteilnummer | EPC8009-FT |
FDMC8884-F126
ON Semiconductor
FDMC8878_F126
ON Semiconductor
FDMC86244
ON Semiconductor
FDMC7692
ON Semiconductor
FDMC7692S-F127
ON Semiconductor
FDMC7672S-F126
ON Semiconductor
FDMC7692S-F126
ON Semiconductor
FDMC7660DC
ON Semiconductor
FDMC612PZ
ON Semiconductor
FDMC4435BZ-F126
ON Semiconductor
XA3S500E-4FTG256I
Xilinx Inc.
XA6SLX25T-3FGG484Q
Xilinx Inc.
A54SX32A-FGG484
Microsemi Corporation
APA300-BGG456M
Microsemi Corporation
A54SX16A-FGG256I
Microsemi Corporation
AT40K20-2AQC
Microchip Technology
EP2S30F672C4
Intel
10M40DCF672C7G
Intel
A42MX16-3PQ100
Microsemi Corporation
EP4CGX22CF19C6N
Intel