Herstellerteilenummer | FDG312P |
---|---|
Zukünftige Teilenummer | FT-FDG312P |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | PowerTrench® |
FDG312P Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
FET-Typ | P-Channel |
Technologie | MOSFET (Metal Oxide) |
Drain-Source-Spannung (Vdss) | 20V |
Strom - kontinuierliche Entleerung (Id) bei 25 ° C | 1.2A (Ta) |
Antriebsspannung (Max Rds On, Min Rds On) | 2.5V, 4.5V |
Rds On (Max) @ Id, Vgs | 180 mOhm @ 1.2A, 4.5V |
Vgs (th) (Max) @ Id | 1.5V @ 250µA |
Gateladung (Qg) (Max) @ Vgs | 5nC @ 4.5V |
Vgs (Max) | ±8V |
Eingangskapazität (Ciss) (Max) @ Vds | 330pF @ 10V |
FET-Funktion | - |
Verlustleistung (max.) | 750mW (Ta) |
Betriebstemperatur | -55°C ~ 150°C (TJ) |
Befestigungsart | Surface Mount |
Supplier Device Package | SC-88 (SC-70-6) |
Paket / fall | 6-TSSOP, SC-88, SOT-363 |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDG312P Gewicht | kontaktiere uns |
Ersatzteilnummer | FDG312P-FT |
SPA15N65C3XKSA1
Infineon Technologies
SPA16N50C3XKSA1
Infineon Technologies
SPA17N80C3XKSA1
Infineon Technologies
SPA20N60CFDXKSA1
Infineon Technologies
SPA20N65C3XKSA1
Infineon Technologies
SPA21N50C3XKSA1
Infineon Technologies
TK12A80W,S4X
Toshiba Semiconductor and Storage
TK16A60W5,S4VX
Toshiba Semiconductor and Storage
TK31A60W,S4VX
Toshiba Semiconductor and Storage
TK35A65W,S5X
Toshiba Semiconductor and Storage
LCMXO2-7000HE-6TG144C
Lattice Semiconductor Corporation
EP1K50TC144-3N
Intel
XC6SLX9-L1FT256C
Xilinx Inc.
EP4SGX360KF43C2
Intel
XC7K70T-1FB484C
Xilinx Inc.
LFE3-35EA-7LFN484I
Lattice Semiconductor Corporation
LCMXO3LF-1300E-5MG121I
Lattice Semiconductor Corporation
5CGXFC7C6U19A7N
Intel
EP1S40F780C5
Intel
EPF6024AQC240-3
Intel