Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RN73C1E10K2BTDF
Herstellerteilenummer | RN73C1E10K2BTDF |
---|---|
Zukünftige Teilenummer | FT-RN73C1E10K2BTDF |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RN73, Holsworthy |
RN73C1E10K2BTDF Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 10.2 kOhms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.063W, 1/16W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±10ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0402 (1005 Metric) |
Supplier Device Package | 0402 |
Größe / Abmessung | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
Höhe - sitzend (max.) | 0.014" (0.35mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RN73C1E10K2BTDF Gewicht | kontaktiere uns |
Ersatzteilnummer | RN73C1E10K2BTDF-FT |
RP73PF1E95K3BTD
TE Connectivity Passive Product
RP73PF1E976RBTD
TE Connectivity Passive Product
RP73PF1E97K6BTD
TE Connectivity Passive Product
RP73PF1E9K31BTD
TE Connectivity Passive Product
RP73PF1E9K76BTD
TE Connectivity Passive Product
RLP73N1ER20FTDF
TE Connectivity Passive Product
RLP73N1ER24FTDF
TE Connectivity Passive Product
RLP73N1ER36FTDF
TE Connectivity Passive Product
RLP73N1ER11FTDF
TE Connectivity Passive Product
RLP73N1ER12FTDF
TE Connectivity Passive Product
EX128-PTQG64
Microsemi Corporation
XCS30-4TQ144C
Xilinx Inc.
XC3S50-4VQG100C
Xilinx Inc.
XC5206-5PQ208C
Xilinx Inc.
EP4CGX75DF27C6N
Intel
EPF10K100EFC484-1N
Intel
XC2V1000-4BG575I
Xilinx Inc.
XC5VSX50T-2FF665I
Xilinx Inc.
A54SX32A-BGG329I
Microsemi Corporation
EPF10K50SQC208-1X
Intel