Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RN73C2A3K57BTDG
Herstellerteilenummer | RN73C2A3K57BTDG |
---|---|
Zukünftige Teilenummer | FT-RN73C2A3K57BTDG |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RN73, Holsworthy |
RN73C2A3K57BTDG Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 3.57 kOhms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.1W, 1/10W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±10ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RN73C2A3K57BTDG Gewicht | kontaktiere uns |
Ersatzteilnummer | RN73C2A3K57BTDG-FT |
RN73C2A2K8BTDF
TE Connectivity Passive Product
RN73C2A2K8BTG
TE Connectivity Passive Product
RN73C2A2K94BTDF
TE Connectivity Passive Product
RN73C2A2K94BTG
TE Connectivity Passive Product
RN73C2A301KBTDF
TE Connectivity Passive Product
RN73C2A301KBTG
TE Connectivity Passive Product
RN73C2A301RBTD
TE Connectivity Passive Product
RN73C2A309KBTDF
TE Connectivity Passive Product
RN73C2A309KBTG
TE Connectivity Passive Product
RN73C2A309RBTDF
TE Connectivity Passive Product
XC7A75T-3FGG676E
Xilinx Inc.
LFE3-35EA-6LFTN256C
Lattice Semiconductor Corporation
A3PN060-VQ100
Microsemi Corporation
EP1K50FC256-3AA
Intel
EP4S40G2F40I3N
Intel
EP4CGX22BF14I7
Intel
EP4SE360F35I3N
Intel
XC6VLX130T-2FFG784C
Xilinx Inc.
XC5VLX85-2FFG676C
Xilinx Inc.
5SGSMD3H1F35C2LN
Intel