Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RN73G2A226KDTDF
Herstellerteilenummer | RN73G2A226KDTDF |
---|---|
Zukünftige Teilenummer | FT-RN73G2A226KDTDF |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RN73, Holsworthy |
RN73G2A226KDTDF Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 226 kOhms |
Toleranz | ±0.5% |
Leistung (Watt) | 0.1W, 1/10W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±50ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RN73G2A226KDTDF Gewicht | kontaktiere uns |
Ersatzteilnummer | RN73G2A226KDTDF-FT |
RN73C2A7R15BTG
TE Connectivity Passive Product
RN73C2A7R32BTDF
TE Connectivity Passive Product
RN73C2A7R32BTG
TE Connectivity Passive Product
RN73C2A7R5BTDF
TE Connectivity Passive Product
RN73C2A7R5BTG
TE Connectivity Passive Product
RN73C2A7R68BTDF
TE Connectivity Passive Product
RN73C2A7R68BTG
TE Connectivity Passive Product
RN73C2A7R87BTDF
TE Connectivity Passive Product
RN73C2A7R87BTG
TE Connectivity Passive Product
RN73C2A80K6BTDF
TE Connectivity Passive Product
EX64-TQG64I
Microsemi Corporation
A54SX08A-TQG144I
Microsemi Corporation
XC3S1400A-5FT256C
Xilinx Inc.
ICE5LP1K-CM36ITR
Lattice Semiconductor Corporation
AGLN250V5-ZVQ100I
Microsemi Corporation
XC4003E-2PC84C
Xilinx Inc.
M2GL060-FGG676I
Microsemi Corporation
EP1S60B956C6
Intel
EP20K200EQC208-3N
Intel
EPF10K50SQC208-3N
Intel