Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RP73D1J38R3BTG
Herstellerteilenummer | RP73D1J38R3BTG |
---|---|
Zukünftige Teilenummer | FT-RP73D1J38R3BTG |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RP73, Holsworthy |
RP73D1J38R3BTG Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 38.3 Ohms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.1W, 1/10W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±15ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0603 (1608 Metric) |
Supplier Device Package | 0603 |
Größe / Abmessung | 0.061" L x 0.031" W (1.55mm x 0.80mm) |
Höhe - sitzend (max.) | 0.022" (0.55mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RP73D1J38R3BTG Gewicht | kontaktiere uns |
Ersatzteilnummer | RP73D1J38R3BTG-FT |
RP73D1J22R6BTG
TE Connectivity Passive Product
RP73D1J232KBTG
TE Connectivity Passive Product
RP73D1J232RBTG
TE Connectivity Passive Product
RP73D1J237KBTG
TE Connectivity Passive Product
RP73D1J237RBTG
TE Connectivity Passive Product
RP73D1J23K2BTG
TE Connectivity Passive Product
RP73D1J23K7BTG
TE Connectivity Passive Product
RP73D1J23R2BTG
TE Connectivity Passive Product
RP73D1J23R7BTG
TE Connectivity Passive Product
RP73D1J243KBTG
TE Connectivity Passive Product
XCV800-4FG676I
Xilinx Inc.
A54SX32A-2PQG208
Microsemi Corporation
A3PN250-Z2VQG100
Microsemi Corporation
10M25DCF484I6G
Intel
10AX032H4F35I3SG
Intel
EP4CE10E22C8
Intel
XC7VX690T-2FFG1927C
Xilinx Inc.
XC6SLX25T-N3CSG324C
Xilinx Inc.
10AX115R2F40I1SG
Intel
EP1C20F324C8N
Intel