Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RP73D2A21KBTDF
Herstellerteilenummer | RP73D2A21KBTDF |
---|---|
Zukünftige Teilenummer | FT-RP73D2A21KBTDF |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RP73, Holsworthy |
RP73D2A21KBTDF Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 21 kOhms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.125W, 1/8W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±15ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RP73D2A21KBTDF Gewicht | kontaktiere uns |
Ersatzteilnummer | RP73D2A21KBTDF-FT |
RP73D2A196KBTDF
TE Connectivity Passive Product
RP73D2A196KBTG
TE Connectivity Passive Product
RP73D2A196RBTDF
TE Connectivity Passive Product
RP73D2A196RBTG
TE Connectivity Passive Product
RP73D2A19K1BTDF
TE Connectivity Passive Product
RP73D2A19K1BTG
TE Connectivity Passive Product
RP73D2A19K6BTDF
TE Connectivity Passive Product
RP73D2A19K6BTG
TE Connectivity Passive Product
RP73D2A19R1BTDF
TE Connectivity Passive Product
RP73D2A19R1BTG
TE Connectivity Passive Product
EX64-TQG64I
Microsemi Corporation
A54SX08A-TQG144I
Microsemi Corporation
XC3S1400A-5FT256C
Xilinx Inc.
ICE5LP1K-CM36ITR
Lattice Semiconductor Corporation
AGLN250V5-ZVQ100I
Microsemi Corporation
XC4003E-2PC84C
Xilinx Inc.
M2GL060-FGG676I
Microsemi Corporation
EP1S60B956C6
Intel
EP20K200EQC208-3N
Intel
EPF10K50SQC208-3N
Intel