Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RP73D2A2K1BTDF
Herstellerteilenummer | RP73D2A2K1BTDF |
---|---|
Zukünftige Teilenummer | FT-RP73D2A2K1BTDF |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RP73, Holsworthy |
RP73D2A2K1BTDF Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 2.1 kOhms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.125W, 1/8W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±15ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RP73D2A2K1BTDF Gewicht | kontaktiere uns |
Ersatzteilnummer | RP73D2A2K1BTDF-FT |
RP73D2A22R1BTG
TE Connectivity Passive Product
RP73D2A22R6BTDF
TE Connectivity Passive Product
RP73D2A22R6BTG
TE Connectivity Passive Product
RP73D2A232KBTDF
TE Connectivity Passive Product
RP73D2A232KBTG
TE Connectivity Passive Product
RP73D2A232RBTDF
TE Connectivity Passive Product
RP73D2A232RBTG
TE Connectivity Passive Product
RP73D2A237KBTDF
TE Connectivity Passive Product
RP73D2A237KBTG
TE Connectivity Passive Product
RP73D2A237RBTDF
TE Connectivity Passive Product
XCV800-4FG676I
Xilinx Inc.
A54SX32A-2PQG208
Microsemi Corporation
A3PN250-Z2VQG100
Microsemi Corporation
10M25DCF484I6G
Intel
10AX032H4F35I3SG
Intel
EP4CE10E22C8
Intel
XC7VX690T-2FFG1927C
Xilinx Inc.
XC6SLX25T-N3CSG324C
Xilinx Inc.
10AX115R2F40I1SG
Intel
EP1C20F324C8N
Intel