Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RP73D2A8R66BTDF
Herstellerteilenummer | RP73D2A8R66BTDF |
---|---|
Zukünftige Teilenummer | FT-RP73D2A8R66BTDF |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RP73, Holsworthy |
RP73D2A8R66BTDF Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 8.66 Ohms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.125W, 1/8W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±15ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RP73D2A8R66BTDF Gewicht | kontaktiere uns |
Ersatzteilnummer | RP73D2A8R66BTDF-FT |
RP73D2A750KBTG
TE Connectivity Passive Product
RP73D2A750RBTDF
TE Connectivity Passive Product
RP73D2A750RBTG
TE Connectivity Passive Product
RP73D2A75KBTDF
TE Connectivity Passive Product
RP73D2A75KBTG
TE Connectivity Passive Product
RP73D2A75RBTDF
TE Connectivity Passive Product
RP73D2A75RBTG
TE Connectivity Passive Product
RP73D2A768KBTDF
TE Connectivity Passive Product
RP73D2A768KBTG
TE Connectivity Passive Product
RP73D2A768RBTDF
TE Connectivity Passive Product
APA075-TQG144I
Microsemi Corporation
XC7K325T-2FBG676C
Xilinx Inc.
A3P1000-PQ208
Microsemi Corporation
AT40K10AL-1EQC
Microchip Technology
EP20K200EFC672-2X
Intel
10M08SAU169I7G
Intel
5SGXEABN2F45I2
Intel
XC5VFX70T-2FFG1136I
Xilinx Inc.
LCMXO2-2000HE-5FTG256I
Lattice Semiconductor Corporation
LCMXO2-7000HE-6FTG256I
Lattice Semiconductor Corporation