Zuhause / Produkte / Widerstände / Chip-Widerstand - Oberflächenmontage / RP73D2A9K09BTG
Herstellerteilenummer | RP73D2A9K09BTG |
---|---|
Zukünftige Teilenummer | FT-RP73D2A9K09BTG |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | RP73, Holsworthy |
RP73D2A9K09BTG Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 9.09 kOhms |
Toleranz | ±0.1% |
Leistung (Watt) | 0.125W, 1/8W |
Zusammensetzung | Thin Film |
Eigenschaften | - |
Temperaturkoeffizient | ±15ppm/°C |
Betriebstemperatur | -55°C ~ 155°C |
Paket / fall | 0805 (2012 Metric) |
Supplier Device Package | 0805 |
Größe / Abmessung | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Höhe - sitzend (max.) | 0.026" (0.65mm) |
Anzahl der Abbrüche | 2 |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
RP73D2A9K09BTG Gewicht | kontaktiere uns |
Ersatzteilnummer | RP73D2A9K09BTG-FT |
RP73D2A7R50BTDF
TE Connectivity Passive Product
RP73D2A7R50BTG
TE Connectivity Passive Product
RP73D2A7R68BTDF
TE Connectivity Passive Product
RP73D2A7R68BTG
TE Connectivity Passive Product
RP73D2A7R87BTDF
TE Connectivity Passive Product
RP73D2A7R87BTG
TE Connectivity Passive Product
RP73D2A806KBTDF
TE Connectivity Passive Product
RP73D2A806KBTG
TE Connectivity Passive Product
RP73D2A806RBTDF
TE Connectivity Passive Product
RP73D2A806RBTG
TE Connectivity Passive Product
EX128-TQG100I
Microsemi Corporation
XC3S200A-4FGG320I
Xilinx Inc.
XCVU3P-L2FFVC1517E
Xilinx Inc.
A3P600-1FG484
Microsemi Corporation
A3P1000L-FG256
Microsemi Corporation
AFS600-1FG256K
Microsemi Corporation
EP2C8F256C6
Intel
5SGXEA7H3F35C2L
Intel
XC7S50-2CSGA324I
Xilinx Inc.
LCMXO3L-4300E-5MG121I
Lattice Semiconductor Corporation