Zuhause / Produkte / Integrierte Schaltungen (ICs) / Embedded - Mikrocontroller / TC212S8F133SCACKXUMA1
Herstellerteilenummer | TC212S8F133SCACKXUMA1 |
---|---|
Zukünftige Teilenummer | FT-TC212S8F133SCACKXUMA1 |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | AURIX™ |
TC212S8F133SCACKXUMA1 Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Kernprozessor | TriCore™ |
Kerngröße | 32-Bit |
Geschwindigkeit | 133MHz |
Konnektivität | CANbus, LINbus, QSPI |
Peripheriegeräte | DMA, WDT |
Anzahl der E / A | - |
Programmspeichergröße | 512KB (512K x 8) |
Programmspeichertyp | FLASH |
EEPROM-Größe | 64K x 8 |
RAM-Größe | 56K x 8 |
Spannung - Versorgung (Vcc / Vdd) | 3.3V |
Datenkonverter | A/D 24x12b |
Oszillatortyp | External |
Betriebstemperatur | -40°C ~ 125°C (TA) |
Paket / fall | Surface Mount |
Supplier Device Package | 80-TQFP Exposed Pad |
PG-TQFP-80-7 | |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
TC212S8F133SCACKXUMA1 Gewicht | kontaktiere uns |
Ersatzteilnummer | TC212S8F133SCACKXUMA1-FT |
S1C17704F101100
Epson Electronics America Inc-Semiconductor Div
S1C17704F401100
Epson Electronics America Inc-Semiconductor Div
S1C17705F101100
Epson Electronics America Inc-Semiconductor Div
S1C17M01F00C100
Epson Electronics America Inc-Semiconductor Div
S1C17M01F201100
Epson Electronics America Inc-Semiconductor Div
S1C17M10F101100
Epson Electronics America Inc-Semiconductor Div
S1C17W22D00B000
Epson Electronics America Inc-Semiconductor Div
S1C17W22F00B100
Epson Electronics America Inc-Semiconductor Div
S6J3001LSESE1000B
Cypress Semiconductor Corp
S6J3001LSJSC1000A
Cypress Semiconductor Corp
XC7A75T-1FGG676C
Xilinx Inc.
XC2V3000-4FGG676I
Xilinx Inc.
XC6SLX75T-3FGG484C
Xilinx Inc.
A3P250-FG256
Microsemi Corporation
A54SX72A-1FG256
Microsemi Corporation
A1415A-VQ100C
Microsemi Corporation
XC6VLX130T-1FF784C
Xilinx Inc.
A42MX16-PQ160M
Microsemi Corporation
LFE2M100SE-6F900C
Lattice Semiconductor Corporation
EP1S40B956C5
Intel