Herstellerteilenummer | FDD5612 |
---|---|
Zukünftige Teilenummer | FT-FDD5612 |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | PowerTrench® |
FDD5612 Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
FET-Typ | N-Channel |
Technologie | MOSFET (Metal Oxide) |
Drain-Source-Spannung (Vdss) | 60V |
Strom - kontinuierliche Entleerung (Id) bei 25 ° C | 5.4A (Ta) |
Antriebsspannung (Max Rds On, Min Rds On) | 6V, 10V |
Rds On (Max) @ Id, Vgs | 55 mOhm @ 5.4A, 10V |
Vgs (th) (Max) @ Id | 3V @ 250µA |
Gateladung (Qg) (Max) @ Vgs | 11nC @ 10V |
Vgs (Max) | ±20V |
Eingangskapazität (Ciss) (Max) @ Vds | 660pF @ 30V |
FET-Funktion | - |
Verlustleistung (max.) | 3.8W (Ta), 42W (Tc) |
Betriebstemperatur | -55°C ~ 175°C (TJ) |
Befestigungsart | Surface Mount |
Supplier Device Package | TO-252-3 |
Paket / fall | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDD5612 Gewicht | kontaktiere uns |
Ersatzteilnummer | FDD5612-FT |
FDD7N60NZTM
ON Semiconductor
FDD9411L-F085
ON Semiconductor
FQD1N80TM
ON Semiconductor
IRFR4105TRPBF
Infineon Technologies
IRLR3636TRPBF
Infineon Technologies
TK33S10N1Z,LQ
Toshiba Semiconductor and Storage
FDD8870
ON Semiconductor
IRFR5410TRPBF
Infineon Technologies
IRLR3410TRPBF
Infineon Technologies
IRLR7833
Infineon Technologies
XA3S500E-4FTG256I
Xilinx Inc.
XA6SLX25T-3FGG484Q
Xilinx Inc.
A54SX32A-FGG484
Microsemi Corporation
APA300-BGG456M
Microsemi Corporation
A54SX16A-FGG256I
Microsemi Corporation
AT40K20-2AQC
Microchip Technology
EP2S30F672C4
Intel
10M40DCF672C7G
Intel
A42MX16-3PQ100
Microsemi Corporation
EP4CGX22CF19C6N
Intel