Herstellerteilenummer | NDB6060 |
---|---|
Zukünftige Teilenummer | FT-NDB6060 |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | - |
NDB6060 Status (Lebenszyklus) | Auf Lager |
Teilestatus | Obsolete |
FET-Typ | N-Channel |
Technologie | MOSFET (Metal Oxide) |
Drain-Source-Spannung (Vdss) | 60V |
Strom - kontinuierliche Entleerung (Id) bei 25 ° C | 48A (Tc) |
Antriebsspannung (Max Rds On, Min Rds On) | 10V |
Rds On (Max) @ Id, Vgs | 25 mOhm @ 24A, 10V |
Vgs (th) (Max) @ Id | 4V @ 250µA |
Gateladung (Qg) (Max) @ Vgs | 70nC @ 10V |
Vgs (Max) | ±20V |
Eingangskapazität (Ciss) (Max) @ Vds | 1800pF @ 25V |
FET-Funktion | - |
Verlustleistung (max.) | 100W (Tc) |
Betriebstemperatur | -65°C ~ 175°C (TJ) |
Befestigungsart | Surface Mount |
Supplier Device Package | D²PAK (TO-263AB) |
Paket / fall | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
NDB6060 Gewicht | kontaktiere uns |
Ersatzteilnummer | NDB6060-FT |
FQB9N50CFTM_WS
ON Semiconductor
FQB9N50TM
ON Semiconductor
FQB9P25TM
ON Semiconductor
HUF75321S3S
ON Semiconductor
HUF75329S3
ON Semiconductor
HUF75332S3ST
ON Semiconductor
HUF75333S3ST
ON Semiconductor
HUF75337S3S
ON Semiconductor
HUF75343S3S
ON Semiconductor
HUF75343S3ST
ON Semiconductor
XC3164A-3TQ144C
Xilinx Inc.
XC7S100-2FGGA484I
Xilinx Inc.
M1A3P400-1FGG484
Microsemi Corporation
A3P1000-FGG256
Microsemi Corporation
5SGXMB6R2F40I2LN
Intel
EP4SGX360NF45C3N
Intel
XC7S50-2CSGA324C
Xilinx Inc.
5CGXFC9A6U19A7N
Intel
EP2AGX65CU17C4G
Intel
5AGXFB1H4F35C4N
Intel