Zuhause / Produkte / Widerstände / Widerstände zur Gehäusemontage / TE200B5R6J
Herstellerteilenummer | TE200B5R6J |
---|---|
Zukünftige Teilenummer | FT-TE200B5R6J |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | TE, CGS |
TE200B5R6J Status (Lebenszyklus) | Auf Lager |
Teilestatus | Active |
Widerstand | 5.6 Ohms |
Toleranz | ±5% |
Leistung (Watt) | 200W |
Zusammensetzung | Wirewound |
Temperaturkoeffizient | ±440ppm/°C |
Betriebstemperatur | -25°C ~ 225°C |
Eigenschaften | Flame Proof, Safety |
Beschichtung, Gehäusetyp | Silicone Coated |
Montagefunktion | Brackets |
Größe / Abmessung | 1.575" Dia x 7.677" L (40.00mm x 195.00mm) |
Höhe - sitzend (max.) | - |
Führungsstil | Solder Lugs |
Paket / fall | Radial, Tubular |
Fehlerrate | - |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
TE200B5R6J Gewicht | kontaktiere uns |
Ersatzteilnummer | TE200B5R6J-FT |
BDS2A1006R8K
TE Connectivity Passive Product
BDS4B1001R0K
TE Connectivity Passive Product
BDS2A1003R3K
TE Connectivity Passive Product
BDS2A10022RK
TE Connectivity Passive Product
BDS2A100330RK
TE Connectivity Passive Product
BDS2A1004R7K
TE Connectivity Passive Product
BDS2A1006K8K
TE Connectivity Passive Product
BDS2A10010KK
TE Connectivity Passive Product
BDS2A100150RK
TE Connectivity Passive Product
BDS2A10015RK
TE Connectivity Passive Product
XCV50-5TQ144I
Xilinx Inc.
XC3S700A-5FGG400C
Xilinx Inc.
XC2V500-4FGG256C
Xilinx Inc.
APA300-FGG256A
Microsemi Corporation
M1A3P250-2VQG100I
Microsemi Corporation
5SGXEA7N2F40I3LN
Intel
5SGXEB5R1F43I2N
Intel
5SGXMA9K1H40I2N
Intel
XC4VSX55-12FFG1148C
Xilinx Inc.
10AX115N3F40I2SGES
Intel