Herstellerteilenummer | FDB5645 |
---|---|
Zukünftige Teilenummer | FT-FDB5645 |
SPQ / MOQ | kontaktiere uns |
Verpackungsmaterial | Reel/Tray/Tube/Others |
Serie | PowerTrench® |
FDB5645 Status (Lebenszyklus) | Auf Lager |
Teilestatus | Obsolete |
FET-Typ | N-Channel |
Technologie | MOSFET (Metal Oxide) |
Drain-Source-Spannung (Vdss) | 60V |
Strom - kontinuierliche Entleerung (Id) bei 25 ° C | 80A (Ta) |
Antriebsspannung (Max Rds On, Min Rds On) | 6V, 10V |
Rds On (Max) @ Id, Vgs | 9.5 mOhm @ 40A, 10V |
Vgs (th) (Max) @ Id | 4V @ 250µA |
Gateladung (Qg) (Max) @ Vgs | 107nC @ 10V |
Vgs (Max) | ±20V |
Eingangskapazität (Ciss) (Max) @ Vds | 4468pF @ 30V |
FET-Funktion | - |
Verlustleistung (max.) | 125W (Tc) |
Betriebstemperatur | -65°C ~ 175°C (TJ) |
Befestigungsart | Surface Mount |
Supplier Device Package | D²PAK (TO-263AB) |
Paket / fall | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
Herkunftsland | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDB5645 Gewicht | kontaktiere uns |
Ersatzteilnummer | FDB5645-FT |
FQB8P10TM
ON Semiconductor
HUF75545S3ST
ON Semiconductor
HUF75645S3ST
ON Semiconductor
FDB024N06
ON Semiconductor
FDB031N08
ON Semiconductor
FDB120N10
ON Semiconductor
FDB12N50TM
ON Semiconductor
FDB14AN06LA0-F085
ON Semiconductor
FDB2532
ON Semiconductor
FDB2552-F085
ON Semiconductor
EX128-TQ100
Microsemi Corporation
XC3S50A-4VQG100I
Xilinx Inc.
A54SX32A-1CQ256
Microsemi Corporation
A3P1000-PQ208
Microsemi Corporation
A42MX16-VQG100M
Microsemi Corporation
EP1SGX10CF672C7N
Intel
10AX016C3U19I2LG
Intel
10CL025ZE144I8G
Intel
5SGXEA7H3F35I4
Intel
EP3SE50F780I3
Intel